Welcome to MaDe Lab!

Our research group focuses on the innovation of manufacturing and design technologies for the mechanical reliability of thin film-based applications such as semiconductor packaging, flexible display, and wearable and bio-integrated electronics. In particular, we explore the mechanical behavior of thin film materials (fracture, interfacial bonding/debonding, deformation, fatigue, stress-strain-induced multiphysics phenomena, etc.) via various experimental and computational methods.