Journal Papers

[17] 

D. J. Kim, S. W. Lee, S. Sung, I. Lee, S. Park, J. Lee, J. J. Kim, S. Kang*, and T.-S. Kim*

"Role of loading mode on crack propagation behavior and adhesion at Cu-SiCN interface"

Applied Surface Science 688,162461 (2025).

[16] 

S. Kang, J. Chang, J. Lim, D. J. Kim. T.-S. Kim, K. C. Choi, J. H. Lee, and S. Kim*

"Graphene-enabled laser lift-off for ultrathin displays"

Nature Communications 15, 8288 (2024).

[15] 

D. J. Kim†, S. Kang†, S. W. Lee, I. Lee, S. Park, J. Lee, J. J. Kim, and T.-S. Kim*

"Effects of surface treatments for the adhesion improvement between Cu and SiCN in BEOL interconnects"

Surfaces and Interfaces 51, 104734 (2024).

[14] 

S. Kang*, J. H. Lee, S. M. Kim, J. Lim, A.-Y. Park, S. Han, J.-Y. Song, and S.-I. Kim

"Machine learning-based solution for thermomechanical analysis of MMIC packaging"

Advanced Materials Technologies 8(5), 2201479 (2023).

[13] 

S. Kang and T.-S. Kim*

"Controlled surface topography of nanofilm by local strain modulation in mechanical transfer process"

Applied Surface Science 608, 155113 (2023).

[12] 

R. You†, S. Kang†, C. Lee†, J. Jeon, J. J. Wie*, T.-S. Kim*, and D. K. Yoon*

"Programmable liquid crystal defect arrays via electric field modulation for mechanically functional liquid crystal networks"

ACS Applied Materials & Interfaces 13(30), 36253-36261 (2021).

[11] 

S. Kang, T. Yoon, B. S. Ma, M. S. Cho, and T.-S. Kim*

"Liquid-assisted adhesion control of graphene-copper interface for damage-free mechanical transfer"

Applied Surface Science 551, 149229 (2021).

[10]

T. I. Kim, I.-J. Park, S. Kang, T.-S. Kim, and S.-Y. Choi*

"Enhanced triboelectric nanogenerator based on tungsten disulfide via thiolated ligand conjugation"

ACS Applied Materials & Interfaces 13(18), 21299-21309 (2021).

[9] 

S. Kang and T.-S. Kim*

"Capillary-force-driven switchable delamination of nanofilms and its application to green selective transfer"

Advanced Materials Technologies 6(3), 2001082 (2021).

[8]

S. Kang and T.-S. Kim*

"Nanofilm transfer methods and interfacial fracture mechanics"

Journal of the Microelectronics and Packaging Society  27(3), 9-19 (2020).

[7] 

T. Yoon†, S. Kang†, T. Y. Kang, and T.-S. Kim*

"Detection of graphene cracks by electromagnetic induction insensitive to doping level"

Computer Modeling in Engineering & Sciences 120(2), 351-361 (2019).

[6]

S. Kang, T. Yoon, S. Kim, and T.-S. Kim*

"Role of crack deflection on rate dependent mechanical transfer of multilayer graphene and its application to transparent electrodes"

ACS Applied Nano Materials 2(4), 1980-1985 (2019).

[5]

I.-J. Park, T. I. Kim, S. Kang, G. W. Shim, Y. Woo, T.-S. Kim, and S.-Y. Choi*

"Stretchable thin-film transistors with molybdenum disulfide channels and graphene electrodes"

Nanoscale 10, 16069 (2018).

[4]

G. Kim, J. Lee, S.-H. Pakr, S. Kang, T.-S. Kim, and Y.-B. Park*

"Comparison of quantitative interfacial adhesion energy measurement method between copper RDL and WPR dielectric interface for FOWLP applications"

Journal of the Microelectronics and Packaging Society  25(2), 41-48 (2018).

[3]

S. Kang, J.-B. Pyo, and T.-S. Kim*

"Layer-by-layer assembly of free-standing nanofilms by controlled rolling"

Langmuir 34(20), 5831-5836 (2018).

[2]

S. Kang, J. Kim, J.-B. Pyo, J. H. Cho, and T.-S. Kim*

"Design of magnetic force field for trajectory control of levitated diamagnetic graphite"

International Journal of Precision Engineering and Manufacturing-Green Technology 5(2), 341-347 (2018).

[1]

I.-J. Park, T. I. Kim, T. Yoon, S. Kang, H. Cho, N. S. Cho, J.-I. Lee, T.-S. Kim, and S.-Y. Choi*

"Flexible and transparent graphene electrode architecture with selective defect decoration for organic light-emitting diodes"

Advanced Funtional Materials 28(10), 1704435 (2018).